Location: Eindhoven University of Technology
5.00 - 5.30pm | Welcome & Drinks |
5.30 - 7.00pm | Lab tour |
7.00 - 9.00pm | Dinner & Drinks |
Location: Pullman Hotel Cocagne, Eindhoven
The complete scientific program, including the abstracts, can be found here.
8.00 - 9.00 | Registration & coffee | ||
9.00 - 9.10 | Welcome | Adrie Mackus | Eindhoven University of Technology |
9:10 - 9:50 | New strategies for area selective deposition | Stacey F. Bent | Stanford University |
9.50 - 10.30 | Perfectly selective thin film CVD using inhibitor molecules | John R. Abelson | University of Illinois at Urbana-Champaign |
10:30 - 11.00 | Break & posters | ||
11.00 - 11.40 | Insight in nucleation mechanisms of semiconducting 2D metal sulfides and application to area selective deposition | Annelies Delabie | IMEC, KU Leuven |
11.40 - 12.20 | Design and synthesis of catalytic nanoparticles via area selective atomic layer deposition | Rong Chen | Huazhong University |
12.20 - 13.00 | Understanding selectivity in thermal atomic layer etching using sequential, self-limiting fluorination and ligand-exchange reactions | Younghee Lee | University of Colorado at Boulder |
13.00 - 14.15 | Lunch & poster session | ||
14.15 - 14.35 | Advanced process technologies for sub-10 nm patterning | Gert Leusink | TEL Technology Center |
14.35 - 14.50 | Effects of hydroxyl density and metal oxide composition on inherent substrate selective ALD of tungsten | Paul C. Lemaire | North Carolina State University |
14.50 - 15.05 | Area-selective ALD of silicon oxide using acetylacetone as inhibitor in a three-step cycle | Alfredo Mameli | Eindhoven University of Technology |
15.05 - 15.20 | Investigating the difference in nucleation of silicon-based materials Si, Si3N4, SiO2 and C-doped SiO2 during PECVD/PEALD for future selective area deposition (S-ALD) | Ekaterina A. Filatova | Tyndall National Institute |
15.20 - 15.45 | Break | ||
15.45 - 16.05 | Selective CVD metal deposition for nano device fabrication | Son Van Nguyen | IBM Semiconductor Research |
16.05 - 16.20 | Area selective Ru ALD for sub 7 nm bottom-up metal interconnects | Ivan Zyulkov | KU Leuven, IMEC |
16.20 - 16.35 | Area selective deposition of metal films | John G. Ekerdt | University of Texas at Austin |
16.35 - 16.55 | Selective deposition: a materials supplier’s perspective | Jean-Marc Girard | Air Liquide Advanced Materials |
16.55 - 17.20 | Break | ||
17.20 - 17.40 | Strategies for area selective atomic layer deposition | Jan Willem Maes | ASM Belgium |
17.40 - 17.55 | Selective deposition using the inherent substrate-dependent growth initiation based on nucleation delay and on the joint use of plasma etching mode | Remy Gassillouda | CEA, LETI |
17.55 - 18.15 | Applications of area selective deposition | David Thompson | Applied Materials |
18.15 - 19.00 | Discussion session: Moderators: Gregory Parsons, Adrie Mackus | ||
19.00 - 21.00 | Drinks & snacks |
Legend
Invited academia | Invited Industry | Contributed |